Industry-leading liquid cooling solutions—optimizing energy efficiency and performance across every level of the data center.
Efficient Fluid Conveyance from Source to Chip-Level Cooling
Revolutionizing Thermal Management with Precision and Performance
In today’s high-density computing environments, traditional air cooling is no longer sufficient. With the rise of AI workloads, hyperscale deployments, and cloud services, data centers demand innovative, energy-efficient cooling strategies that can handle increasing thermal loads. Danfoss, a global leader in fluid conveyance and thermal solutions, has engineered a cutting-edge liquid cooling portfolio to meet these demands—offering direct-to-chip cooling systems that deliver unmatched performance, reliability, and sustainability.
Why Liquid Cooling?
Liquid cooling isn’t just a trend—it’s a transformative technology. Compared to air-based methods, liquid cooling offers:
It enables greater chip density, lowers the carbon footprint, and simplifies maintenance compared to immersion cooling or hybrid air-liquid setups. At the heart of this shift is Danfoss’ mission to make liquid cooling efficient, resilient, and scalable.
Danfoss’ source line components are designed to transfer coolant from the distribution unit (CDU) to the server rack, while maintaining full-flow, leak-free performance and ease of installation.
FD83 Series – Full-Flow Dual-Interlock Coupling
The industry standard in reliable cooling connectivity, the FD83 is made of stainless steel or engineered plastic and features:
MLDB Series – Flat Face, Dry Break Coupling
Ideal for applications requiring minimal fluid loss and clean disconnection:
FC332 – Socketless Hose
Boston Royal™ EHW194 – EPDM Hose
Socketless Fittings
These brass or stainless steel fittings are designed for rapid deployment:
Designed for angled routing and compact installations:
Within the rack, Danfoss delivers high-flow, leak-free connections that ensure optimal thermal transfer directly to server chips—especially where space and access are limited.
OCP ORV3 BMQC – Blind-Mate Quick Disconnect
ADB Series – Flat Face Coupling
UQD – Universal Quick Disconnect
UQDB – Universal Blind-Mate Quick Disconnect
Boston Royal™ EHW194 – Repeated Use
As with source lines, this hose provides:
Danfoss is not only meeting the rising thermal demands of modern data centers—they're setting the benchmark for what’s possible. Their comprehensive liquid cooling portfolio spans every connection point, from CDU to chip, ensuring:
Whether you're designing new hyperscale facilities or retrofitting for higher efficiency, Danfoss delivers fluid conveyance solutions you can trust—backed by decades of proven expertise.
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